Glossary entry (derived from question below)
Japanese term or phrase:
基板厚出し工程
English translation:
substrate thickness control
Added to glossary by
yuzouren
Jul 18, 2007 20:58
16 yrs ago
Japanese term
Mr. Meticulous
Native in: English 
, Japanese
Works in: Japanese to English, Turkish to English, English to Japanese, and 3 more.
基板厚出し工程
Japanese to English
Tech/Engineering
Manufacturing
...having to do with glass substrates...
Does anyone have an English translation of this?
Does anyone have an English translation of this?
Proposed translations
(English)
Change log
Jul 24, 2007 01:56: yuzouren Created KOG entry
Proposed translations
1 day 2 hrs
Selected
substrate thinckness control
or
To control the thickness of substrate
I do not think there is a need to translate "process(工程)"
To control the thickness of substrate
I do not think there is a need to translate "process(工程)"
4 KudoZ points awarded for this answer.
Comment: "I used this one. Thanks to all for all the great help."
11 hrs
Process for "controlling" the substrate thickness
Had other translators responded, I would have declined this time, but in the absence of other answers, I suggest the above term, using 出す in its rarely used meaning of "to squeeze".
I have never seen this term before, D J Newport
I have never seen this term before, D J Newport
14 hrs
Process of (solder) bump formation on substrate
just a guess
at high number of bumps (solder bump formation on wafer level), .... is removed and replaced by a glass substrate, solder bumps are deposited, ...
www.ulm-photonics.de/docs/pr/veroeffentlichungen/spie_4994-... -
at high number of bumps (solder bump formation on wafer level), .... is removed and replaced by a glass substrate, solder bumps are deposited, ...
www.ulm-photonics.de/docs/pr/veroeffentlichungen/spie_4994-... -
+1
17 hrs
process the substrate thickness
This is a guess, but according to my husband's explanation (he is a Japanese engineer), in this case, 出し takes on the meaning of processing and would mean to "process the thickness" by polishing or grinding for example. Since 工程 also means process, I think that it isn't necessary to say it twice.
--------------------------------------------------
Note added at 2 days11 hrs (2007-07-21 08:23:06 GMT)
--------------------------------------------------
Conejo's wording "to make the substrate the right thickness" is the nuance I wanted to convey, but I feel like this might be a little wordy.
--------------------------------------------------
Note added at 2 days11 hrs (2007-07-21 08:23:06 GMT)
--------------------------------------------------
Conejo's wording "to make the substrate the right thickness" is the nuance I wanted to convey, but I feel like this might be a little wordy.
Peer comment(s):
| agree |
conejo
: Hmm, I think this is the best wording, but I think what it actually means is to "make the substrate the right thickness"
1 day 10 hrs
|
Discussion